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Description
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Plasma-enhanced atomic layer deposition (PE-ALD) enables atomic-scale interface engineering by combining saturation-limited growth with non-equilibrium plasma chemistry. This review examines how plasma–surface interactions control composition, defect density, and interfacial energetics across energy and environmental technologies. In photocatalysis and photoelectrochemistry, PE-ALD regulates nucleation and heterojunction formation, governing charge separation and transport. In water treatment, it enables sub-nanometer tuning of pore structure and surface chemistry, linking interfaces to selective transport and fouling resistance. In piezoelectric and thermoelectric systems, it provides low-temperature control of crystallographic orientation and interfacial coupling. This versatility across oxides, nitrides, and polymeric substrates expands the accessible design space beyond thermal processes. (2026-06-01)
***This entry has been automatically imported via OpenAlex by LIST harvest scripts. Please refer to https://doi.org/10.1002/ppap.70212 for the original and latest version of the publication*** (2026-07-01)
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Keyword
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Heterojunction, Nucleation, Piezoelectricity, Fouling, Thermoelectric effect, Thermal, Interface (matter), Surface energy, Deposition (geology), Photocatalysis |